Thermally Conductive Acrylic Interface Pad 5590H

3M™ Thermally Conductive Acrylic Interface Pad 5590H

3M™ Thermally Conductive Acrylic Interface Pad 5590H is designed to provide a preferential heat transfer path between heat generating components, such as IC Chip or Electric Vehicle (EV) battery, and heat sink or spreader. It consists of highly conformable, slightly tacky acrylic elastomer sheets filled with thermally conductive ceramic particles. These highperforming thermal pads have the following features:

Key Features

• Easy handling and soft pad
• High conformability even for non-flat IC surfaces and automotive EV batteries
• Incorporates a thin, firm acrylic layer for good handling
• Highly thermally conductive while electrically insulating
• Slight tack allows pre-assembly
• Good wettability for better thermal conductivity
• Non-silicone acrylic elastomer
• Excellent durability
• UL94 V-0 listed (File No. E176845)

Product Construction/Material Description

 

Thermally conductive conformable layer

Thermally conductive firm layer (less tack) permanent

PET liner (outside of roll)

 

Note: The following technical information and data should be considered representative or typical only and should not be used for specification purposes.

3M™ Thermally Conductive Acrylic Interface Pad 5590H

Property

Value

Color

White/Gray

Base resin

Acrylic

Thickness

0.5, 1.0mm, 1.5 mm, 2.0 mm (thicker pads available upon request)

Filler type

Ceramic

Very low tack layer

Good for re-workability and handling, light gray color-permanent layer

Low tack layer

Soft, good thermal conductivity, white color

Applications

  • Heattransfer in consumer electronics and automotive electronic products
  • Decreaseof compression stress to electronic parts by thermal pad conformability 

 

 Examples:

    • Heattransfer between PCB and heat sink
    • Thermalmanagement in automotive EV batteries
    • Powerelectronics component thermal management
    • Chipon film (COF) heat conduction
    • Automotiveelectronics
    • LEDthermal management
    • Generalgap filling in electronic devices