3M™ Thermally Conductive Interface Tape 8708 Series
3M™ Thermally Conductive Interface Tape 8708 series have a pressure sensitive adhesive tape filled with thermally
conductive ceramic particles. This product has different adhesion strength on top and bottom. 3M tape series 8708
demonstrates strong adhesion performance on the liner side through a uniquely constructed PSA layer. Softness of this
product is good enough to wet-out well on uneven surfaces with normal bonding pressure (~1kgf/cm²) and maintains
the holding power under some severe environmental conditions.
Key Features
Good thermal conductivity (0.6W/m-K)
• Electrically insulating
• Low thermal impedance
• Good and reliable adhesion performance for aluminum (Al) and steel use stainless (SUS)
• Vibration damping
Product Construction/Material Description
Color Yellowish white
Adhesive Type Soft acrylic adhesive
Tape Thickness 0.13 mm, 0.25 mm, 0.50 mm
Primary Filler Type Ceramic
Product Liner 130 μm paper liner with red “3M electronics” logo
Standard Roll Length* 40 MT
Applications
- General heat sink bonding
- IC chip packaging heat conduction
- Printed circuit boards (PCB)
- LED module/board bonding
- Flat panel display assembly (e.g. LCD and PDP devices)
- COF chip heat conduction
Mechanical fastening such as clamp, bracket, and screw can be used in parallel with this thermal conductive tape.
Application Techniques
• Bond strength is dependent upon the amount of adhesive to surface contact developed. Firm application pressure helps to develop better adhesive contact and improve bonding strength.
• To obtain optimum adhesion, the bonding surfaces must be clean, dry and well unified. Typical surface cleaning solvents are isopropyl alcohol and water (rubbing alcohol) or heptane.
Note: Be sure to follow manufacturer’s safety precautions and directions for use when using solvents.
• Ideal tape application temperature range is 21°C to 38°C (70°F to 100°F). Initial tape application to surfaces at temperatures below 10°C (50°F) is not recommended because the adhesive becomes too firm to adhere readily.
However, once properly applied, low temperature holding is generally satisfactory.
Typical Physical Properties and Performance Characteristics
Property |
| Methoda | 8708-013 | 8708-025 | 8708-050 |
Thickness (mm) | — | 0.13 | 0.25 | 0.5 | |
90° Peel Adhesion (g/25.4mm) SUS304 test substrate | Liner side Non-liner side | ASTM D-3330 15 min dwell at 23°C | > 2000 > 800 | > 2000 > 800 | > 2000 > 800 |
Liner side Non-liner side | ASTM D-3330 72 hrs dwell at 70°C (for reference) | > 3000 > 1000 | > 3000 > 1000 | > 3000 > 1000 | |
Dynamic Shear Initial Strength (Kg/in2) | ASTM D-1002 | > 20 | |||
Foam Density (grams/cm3) | — | 1.50 | |||
Dielectric Strength (kV/mm) | ASTM D149 | 15 | |||
Thermal Conductivity (W/mK)b | ASTM C1113 | 0.6 | |||